Process Ability

• Products : Single side Pb,LF, RoSH
  • Green Environmental
  • Procurement
• Board Thickness : 0.8 mm. - 1.6 mm.
• Track Width/Space : 0.2 mm. / 0.2 mm.
• Min Finished Hole : 0.6 mm.
• Solder Resists Clearance : Minimum 0.1mm
• Carbon Trace/ Gap : 0.4mm/0.5mm>
• Minimum Tooling Hole : 0.6mm
• Special Process : Carbon, Carbon T/H
• Finish : Rosin Flux, Water base Flux
  • Hot Air Leveling, Nickel

• Pruduct :Double side Pb ,Rosh ,LF
  • :Double side Carbon Thru Hole
  • :Double side Silver Thru Hole
  • :Double side non Thru Hole.
  • :Finishing Tin plating
    • Hot Air Leveling
    • Nickel plating
    • OSP ,etc